Live MPW Design Rules
LIVE: Ninth Call Design Rules
CORNERSTONE users are invited to submit designs to the ninth call. The platform is 500 nm Si / 3 µm buried oxide (BOX) silicon-on-insulator (SOI). There will be 2 silicon etches with etch depths of 160 nm (grating couplers) and 300 nm (rib waveguides). There will be a 1 µm thick top cladding silicon dioxide layer.
Access to this run is free of charge for UK research institutes (funded by EPSRC). Overseas universities and industrial companies can access this run with the following cost options:
Design area: 11.47 mm x 4.9 mm = £5,000.
Design area: 5.5 mm x 4.9 mm = £3,500.
The mask submission deadline is Friday 30th November 2018.
For more information, full design rules and quick reference design rules, please download the CORNERSTONE 9th Call Design Rules documents and the .GDSII template files.