CORNERSTONE Multi Project Wafer Run 4 Announced

The design rules for CORNERSTONE multi project wafer (MPW) run 4 have been announced. There will be:

  • 3 Si etch processes:

1) a shallow Si etch of 70 nm (grating couplers),

2) an intermediate Si etch of 120 nm (rib waveguides), and

3) a continuation Si etch of a further 100 nm to the BOX layer (strip waveguides).

  • 4 Si implants for active device fabrication, as well as a single metal layer for ohmic Si contacts, on top of a 1 μm thick SiO2 top cladding layer.
  • Metal heaters.

Access to this run is free of charge for UK research institutes (funded by EPSRC). Overseas universities and industrial companies can access this run for a charge of £35,000. Due to popular demand, we are also offering a reduced design space of 5.5 mm x 4.9 mm for a discounted cost of £20,000.

More information on can be found here.

The mask submission deadline is Friday 1st December 2017.